· 16 Layers 7-Steps HDI with ENEPIG
· MSAP Process, Min. Line Space 0.04mm
· BGA Pitch 0.13mm, Spacing 0.02mm
· Impedance Tolerance ±8%
· 8 Layers 2-Steps HDI with ENIG+Gold plating
· EMC EM-892K2
· Impedance Tolerance ±5%
· Insertion Loss Requirement: 0.497 dB/inch @ 26.56 GHz
· 12-Layer 5 Steps ELIC HDI with ENEPIG
· Very Low loss, Low DK materials
· 76/50um Bonding pad
· Impedance tolerance ±8%
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